PART |
Description |
Maker |
FGA272-638G FGA303-638G FGAX600-638G FGA304-638G F |
272 POS 1.27MM BGA ADAPTER BGA272, IC SOCKET 303 POS 1.27MM BGA ADAPTER BGA303, IC SOCKET 600 POS 1.27MM BGA EXTRACTION ADAPTER BGA600, IC SOCKET 304 POS 1.27MM BGA ADAPTER BGA304, IC SOCKET 168 POS 1.27MM BGA EXTRACTION ADAPTER BGA168, IC SOCKET 304 POS 1.27MM BGA EXTRACTION ADAPTER 255 POS 1.27MM BGA EXTRACTION ADAPTER 357 POS 1.27MM BGA ADAPTER 560 POS 1.27MM BGA ADAPTER
|
Advanced Interconnections, Corp. ADVANCED INTERCONNECTIONS CORP
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PUMA2F16006M-90 PUMA2F16006-90 PUMA2F16006M-120E P |
32-Tap, Volatile DPP with I2C/DEC, Up/Down Interface, TSSOP BGA, ROHS-A, IND TEMP, T&R(ARM) BGA,GREEN,IND TEMP,T&R(ARM) x32 Flash EEPROM Module X32号,闪存EEPROM模块 EEPROM EEPROM
|
Infineon Technologies AG Amphenol Tuchel
|
HYRDU64164M-80M HYRDU72184M-80M HYRDU72184M-60M |
4M X 16 RAMBUS, PBGA66 MICRO, BGA-66 4M X 18 RAMBUS, PBGA74 MICRO, BGA-74
|
Hynix Semiconductor, Inc.
|
2FGA320-638G 2FGAX241-720G |
320 POS 1.27MM BGA ADAPTER 241 POS 1.27MM BGA SMT ADAPTER
|
Advanced Interconnections
|
IBM25PPC405GP-3BE266C IBM25PPC405GP-3EE200C IBM25P |
MICROPROCESSOR|32-BIT|CMOS|BGA|413PIN|PLASTIC MICROPROCESSOR|32-BIT|CMOS|BGA|456PIN|PLASTIC 微处理器| 32位|的CMOS | BGA封装| 456PIN |塑料
|
Jameco Electronics Mitel Networks, Corp.
|
TSC51C2XXX-12IB TSC51C2XXX-16IB TSC51C2XXX-A12IB T |
IC MAX 7000 CPLD 512 208-PQFP IC MAX IIZ CPLD 570 LE 256-MBGA IC MAX 7000 CPLD 512 256-FBGA 484-pin FineLine BGA RoHS Compliant: Yes 956-pin BGA RoHS Compliant: Yes IC,FPGA,32470-CELL,CMOS,BGA,1020PIN,PLASTIC FPGA Logic IC Logic Type:FPGA; No. of Macrocells:726; Package/Case:1020-BGA; Leaded Process Compatible:No; Number of Circuits:32; IC,FPGA,4800-CELL,CMOS,BGA,484PIN,PLASTIC IC,FPGA,10570-CELL,CMOS,BGA,672PIN,PLASTIC IC,FPGA,14400-CELL,CMOS,BGA,780PIN,PLASTIC No. of Macrocells:192; No. of Pins:68; Operating Temp. Max:85°C; Operating Temp. Min:0°C; Propagation Delay:7.5ns RoHS Compliant: Yes; No. of Macrocells:192; No. of Pins:100; Operating Temp. Max:85°C; Operating Temp. Min:0°C; Propagation Delay:7.5ns RoHS Compliant: Yes; No. of Macrocells:160; No. of Pins:84; Operating Temp. Max:70 C; Operating Temp. Min:0 C; Propagation Delay:10ns RoHS Compliant: Yes; No. of Macrocells:440; No. of Pins:100; Operating Temp. Max:85°C; Operating Temp. Min:0°C; Propagation Delay:9ns RoHS Compliant: Yes; 8-BIT MICROCONTROLLER 8位微控制 IC MAX 7000 CPLD 128 100-PQFP 8位微控制 IC MAX 7000 CPLD 160 84-PLCC 8位微控制
|
TE Connectivity, Ltd. Diodes, Inc. Semtech, Corp.
|
IBM25PPC405EP-3GB200C IBM25PPC405EP-3GB133C IBM25P |
32-BIT, 200 MHz, RISC PROCESSOR, PBGA385 31 MM, ENHANCED, PLASTIC, BGA-385 32-BIT, 133.33 MHz, RISC PROCESSOR, PBGA385 31 MM, ENHANCED, PLASTIC, BGA-385 32-BIT, 333.33 MHz, RISC PROCESSOR, PBGA385 31 MM, ENHANCED, PLASTIC, BGA-385 32-BIT, 266.66 MHz, RISC PROCESSOR, PBGA385 31 MM, ENHANCED, PLASTIC, BGA-385
|
Electronic Theatre Controls, Inc.
|
EPM7512AEBC256-10 EPM7256AEFC100-10 |
COMPLEX-EEPLD,512-CELL,10NS PROP DELAY,BGA,256PIN,PLASTIC COMPLEX-EEPLD,256-CELL,10NS PROP DELAY,BGA,100PIN,PLASTIC
|
Altera Corp
|
K7P401822B-HC16 K7P401822B-HC20 K7P401822B-HC25 K7 |
SENSOR DIFF VACUUM GAGE 10 H2O 128K × 36 128Kx36 & 256Kx18 Synchronous Pipelined SRAM 128K × 36 256K X 18 STANDARD SRAM, 2.7 ns, PBGA119 14 X 22 MM, BGA-119 128K X 36 STANDARD SRAM, 2.7 ns, PBGA119 14 X 22 MM, BGA-119 256K X 18 STANDARD SRAM, 3 ns, PBGA119 14 X 22 MM, BGA-119 SENSOR DIFF VACUUM GAGE 1PSI SENSOR ABSOLUTE 0-15PSIA 128Kx36 & 256Kx18 Synchronous Pipelined SRAM
|
Samsung Semiconductor Co., Ltd. SAMSUNG SEMICONDUCTOR CO. LTD. SAMSUNG[Samsung semiconductor]
|
K7P401823B-HC650 K7P401823B-HC750 K7P403623B |
256K X 18 STANDARD SRAM, 6.5 ns, PBGA119 14 X 22 MM, BGA-119 256K X 18 STANDARD SRAM, 7.5 ns, PBGA119 14 X 22 MM, BGA-119 128Kx36 & 256Kx18 SRAM
|
Samsung semiconductor
|
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